Semiconductor technology, consumer electronics, material sciences expert
John C. Bravman, PhD, Exclusive Expert Witness
Dr. Bravman has over 25 years of experience consulting for the computer, semiconductor, consumer electronics and material sciences industries with Fairchild Semiconductor Laboratories, Lockheed, National Semiconductor, Advanced Micro Devices, IBM, Intel and Applied Plasma Laboratories.
Areas of Engineering and Semiconductor Expertise
- Analysis
- Electromigration phenomena
- High spatial resolutions materials
- IC failure processes and phenomena
- Integrated circuit manufacturing
- Mechanical behavior of thin films
- Microelectronic materials analysis
- Microelectronic packaging
- Structures and materials
Technologies
- Electronic component design
- Electronics/microelectronics
- Integrated circuit design
- Materials science
- Semiconductor device design
- Semiconductor manufacturing
Educational Background
BS from Stanford University, 1979
MS from Stanford University, 1982
PhD from Stanford University, 1984
Employment History
Dr. Bravman has over 25 years of experience consulting in the computer, semiconductor technology, consumer electronics and material sciences industries with Fairchild Semiconductor Laboratories, Lockheed, National Semiconductor, Advanced Micro Devices, IBM, Intel and Applied Plasma Laboratories.
1984: Joined the Stanford faculty
1996 to 1999: Department chair, Stanford University
1992 to 2001: Senior Associate Dean in the School of Engineering, Stanford University
He has consulted and testified in numerous intellectual property litigation matters in federal, district and ITC venues.
He has also served the government on many review boards, including the Solid State Sciences Committee, and has served on or chaired the National Advisory Board of the Materials Programs at Sandia National Laboratories and the Chemical and Materials Sciences Program at Lawrence Livermore National Laboratories.
Dr. Bravman teaches and advises undergraduates at all levels and directs doctoral students in the areas of silicon process technology, the mechanical properties of thin films, and transmission electron microscopy. He has served as a Resident Fellow and a University Fellow, and has chaired many university committees on integrated circuit manufacturing for computing.
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