I have 29 years of experience in the field of electrochemistry, with specific knowledge of electrodeposition, surface finishing, materials, corrosion, self-assembly and nanotechnology. I am also knowledgeable in the areas of connectors, leadframes, semiconductor packaging and wafer back-end processing. I have published on such topics as electroplating, surface finishing, semiconductor packaging, self-assembled manolayers, nanotechnology and contact reliability. I have published over 100 technical papers and hold close to 40 US patents with other patents pending.